Effect of the Cu stabilisation layer on the turn-to-turn contact resistance of a non-insulated REBCO winding
Zili Zhang, Kangshuai Wang, Xufeng Wang, Shunzhong Chen, Hongli Suo, Lin Ma, Jianhua Liu, Lei Wang, Qiuliang Wang
Topics & Concepts
Materials scienceContact resistanceMicrostructureElectrical conductorTurn (biochemistry)Composite materialCarbideLayer (electronics)SuperconductivityOxideMagnetic fieldMetallurgyCondensed matter physicsNuclear magnetic resonancePhysicsQuantum mechanicsPhysics of Superconductivity and MagnetismSuperconducting Materials and ApplicationsHVDC Systems and Fault Protection