Litcius/Paper detail

Layer-by-layer assembly of boron arsenide and copper nanoflake-based aramid nanofibers for thermoconductive electromagnetic interference shielding materials with superior mechanical flexibility and flame retardancy

Van Cuong Nguyen, Vi Nguyen Pham, Chi Thien Nguyen, Le Hoang Ai Pham, Duy Khiem Nguyen, Mai Thi Kieu Lien, Minh Canh Vu

2024Journal of Industrial and Engineering Chemistry9 citationsDOI

Topics & Concepts

AramidElectromagnetic shieldingMaterials scienceLayer (electronics)Electromagnetic interferenceBoronCopperFlexibility (engineering)NanofiberInterference (communication)OptoelectronicsComposite materialNanotechnologyMetallurgyChemistryTelecommunicationsFiberComputer scienceStatisticsChannel (broadcasting)Organic chemistryMathematicsElectromagnetic wave absorption materialsFlame retardant materials and propertiesGraphene research and applications