An optimized passivation mechanism at the copper film recess for achieving efficient planarization of copper chemical mechanical polishing
Nengyuan Zeng, Chenwei Wang, Chong Luo, Hongdong Zhao, Yuling Liu, Wantang Wang, Tengda Ma
Topics & Concepts
Chemical-mechanical planarizationCopperPolishingMaterials scienceSlurryDissolutionPassivationWaferMetallurgyX-ray photoelectron spectroscopyLayer (electronics)Chemical engineeringComposite materialNanotechnologyEngineeringAdvanced Surface Polishing TechniquesCopper Interconnects and ReliabilitySemiconductor materials and devices