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Binding Interactions in Copper, Silver and Gold π‐Complexes

Jaya Mehara, Brandon T. Watson, Anurag Noonikara‐Poyil, Adway O. Zacharias, Jana Roithová, H. V. Rasika Dias

2022Chemistry - A European Journal35 citationsDOIOpen Access PDF

Abstract

The copper(I), silver(I), and gold(I) metals bind π-ligands by σ-bonding and π-back bonding interactions. These interactions were investigated using bidentate ancillary ligands with electron donating and withdrawing substituents. The π-ligands span from ethylene to larger terminal and internal alkenes and alkynes. Results of X-ray crystallography, NMR, and IR spectroscopy and gas phase experiments show that the binding energies increase in the order Ag<Cu<Au and the binding energies are slightly higher for alkynes than for alkenes. Modulation of the electron density at the metal using substituents on the ancillary ligands shows that the π-back bonding interaction plays a dominant role for the binding in the copper and gold complexes.

Topics & Concepts

CopperDenticityChemistryEthyleneMetalCrystallographyBinding energyLigand (biochemistry)StereochemistryOrganic chemistryCatalysisReceptorNuclear physicsPhysicsBiochemistryCatalytic Alkyne ReactionsOrganometallic Complex Synthesis and CatalysisClick Chemistry and Applications