Mesoporous hollow silica with controlled particle size for optimizing dielectric properties and coefficient of thermal expansion of polyimide packaging materials
Tianqi Hou, Xia Liu, Junwen Ren, Xianzhen Xu, Di Lan, Siyuan Zhang, Hua Guo, Guangrong Wu, Zirui Jia, Guanglei Wu
Topics & Concepts
PolyimideMaterials scienceThermal expansionComposite materialDielectricParticle sizeMesoporous silicaThermalMesoporous materialChemical engineeringOptoelectronicsLayer (electronics)CatalysisOrganic chemistryChemistryPhysicsEngineeringMeteorologySynthesis and properties of polymersSilicone and Siloxane ChemistryEpoxy Resin Curing Processes