A review of the thermal conductivity of silver-epoxy nanocomposites as encapsulation material for packaging applications
Zhijian Sun, Jiaxiong Li, Michael Yu, Mohanalingam Kathaperumal, Ching‐Ping Wong
Topics & Concepts
EpoxyMaterials scienceThermal conductivityNanocompositeSilver nanoparticleNanomaterialsElectronic packagingComposite materialThermal resistanceNanoparticleNanotechnologyThermalMeteorologyPhysicsThermal properties of materialsHigh voltage insulation and dielectric phenomenaMechanical Behavior of Composites