Litcius/Paper detail

Numerical thermal analysis and structural optimization of cascaded PCM heat sinks for thermal management of electronics

Shoujin Chang, Bing Liu, Xiao‐Ying Gao, Xuan Li, Yingze Meng, Haitao Hu

2024International Journal of Heat and Mass Transfer18 citationsDOI

Topics & Concepts

Heat sinkThermal management of electronic devices and systemsThermalElectronicsMaterials scienceElectronics coolingMechanicsNuclear engineeringMechanical engineeringThermodynamicsElectrical engineeringPhysicsEngineeringPhase Change Materials ResearchHeat Transfer and OptimizationThermal properties of materials
Numerical thermal analysis and structural optimization of cascaded PCM heat sinks for thermal management of electronics | Litcius