Litcius/Paper detail

A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging

Harindra Kumar Kannojia, Pradeep Dixit

2021Journal of Materials Science Materials in Electronics70 citationsDOI

Topics & Concepts

Materials scienceIntermetallicVoid (composites)CopperBrittlenessSurface roughnessWaferComposite materialWire bondingSurface finishMetallurgyNanotechnologyAlloyElectrical engineeringEngineeringChipElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis
A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging | Litcius