Investigation of failure mechanism of aluminum-scandium wire bond contact under active power cycle test
Tadashi Yamaguchi, Yuya Suto, Noritoshi Araki, Motoki Eto, Felix R. Fischer, Anne Groth
Topics & Concepts
Materials scienceWire bondingBondComposite materialBond lengthAluminiumShear (geology)Shear forceBond strengthStructural engineeringChemistryAdhesiveCrystallographyElectrical engineeringLayer (electronics)EngineeringChipEconomicsFinanceCrystal structureElectronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor TechnologiesAluminum Alloys Composites Properties