Hybrid Substrate With Ultralarge Organic Interposer for Heterogeneous Integration
John H. Lau, Curry Lin, Hsing-Ning Liu, Kai-Ming Yang, Tim Xia, Cheng-Ta Ko, Bruce Puru Lin, Yu-Ling Chuang, Rui Chen, M. Ma, Tzyy-Jang Tseng, Ming Li, K. Leung
Abstract
In this study, the fan-out chip-last panel-level packaging method in fabricating an ultralarge organic interposer of a hybrid substrate for heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and simulation of thermomechanical reliability of a hybrid substrate ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$85\times80$ </tex-math></inline-formula> mm), which consists of an ultralarge organic interposer (four redistribution layers (RDLs) with the minimum metal linewidth ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$L$ </tex-math></inline-formula> ) and spacing ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$S$ </tex-math></inline-formula> ) = 2 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> ), a 5-2-5 build-up package substrate, and Sn0.7Cu solder joints with underfill. Also, some recommendations will be provided.