Effect of curing pressure on the curing behavior of an epoxy system: Curing kinetics and simulation verification
Qun Liang, Xiping Feng, Kun Zhang, Xue-Mei Hui, Xiao Hou, Jin-Rui Ye
Topics & Concepts
Curing (chemistry)Materials scienceEpoxyComposite materialIsothermal processKineticsActivation energyDifferential scanning calorimetryAutocatalysisDiglycidyl etherOrder of reactionBisphenol AThermodynamicsChemistryReaction rate constantOrganic chemistryPhysicsQuantum mechanicsEpoxy Resin Curing ProcessesThermal and Kinetic AnalysisPolymer crystallization and properties