Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding
Zezong Zhang, Xiaowu Hu, Wenjing Chen, Sifan Tan, Bin Chen, Jue Wang, Lan Jiang, Yifan Huang, Guangyu Zhu, Yinshui He, Xiongxin Jiang, Qinglin Li
Topics & Concepts
Materials scienceSolderingIntermetallicMicrostructureIsothermal processShear (geology)Composite materialShear strength (soil)Temperature gradientMetallurgyAlloyPhysicsSoil scienceEnvironmental scienceSoil waterThermodynamicsQuantum mechanicsElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisAluminum Alloys Composites Properties