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An efficient thermal model of chiplet heterogeneous integration system for steady-state temperature prediction

Chenghan Wang, Qinzhi Xu, Chuanjun Nie, He Cao, Jianyun Liu, Zhiqiang Li

2023Microelectronics Reliability26 citationsDOI

Topics & Concepts

Heat sinkThermalWaferComputer scienceSystem integrationSteady state (chemistry)Scale (ratio)Mechanical engineeringEngineeringElectrical engineeringChemistryPhysicsQuantum mechanicsOperating systemPhysical chemistryMeteorology3D IC and TSV technologiesAdvancements in Semiconductor Devices and Circuit DesignSemiconductor materials and devices
An efficient thermal model of chiplet heterogeneous integration system for steady-state temperature prediction | Litcius