Microstructural Evaluation during dissimilar transient liquid phase bonding of TiAl/Ni-based superalloy
Dariush Kokabi, Ali Kaflou, Reza Gholamipour, M. Pouranvari
Topics & Concepts
Materials scienceIntermetallicBorideEutectic systemSuperalloyMetallurgySolid solutionAlloySilicidePrecipitationIsothermal processSiliconThermodynamicsPhysicsMeteorologyIntermetallics and Advanced Alloy PropertiesHigh Temperature Alloys and CreepSemiconductor materials and interfaces