Effects of a thermal-ultrasonic stress relaxation process on the residual stress, mechanical properties and microstructures of C19400 copper alloy strips
Fei Zhou, Yanmin Zhang, Longlong Lu, Kexing Song, Hongjiao Gao
Topics & Concepts
Materials scienceResidual stressElectron backscatter diffractionStress relaxationComposite materialMicrostructureAlloyDislocationStress (linguistics)MetallurgyCreepLinguisticsPhilosophyMicrostructure and mechanical propertiesAdvanced Welding Techniques AnalysisAluminum Alloy Microstructure Properties