Impact of Amino-Alcohol Organic Molecule on Various Silicon Oxide Bondings
Aziliz Calvez, Frank Fournel, Vincent Larrey, Gaëlle Eleouet, Christophe Morales, F. Rieutord
Abstract
Recently a new surface preparation method using an organic molecule was introduced for silicon direct wafer bonding F. Fournel, L. Continni, C. Morales, J. Da Fonseca, H. Moriceau, F. Rieutord, A. Barthelemy, and I. Radu, J. Appl. Phys. , 111 , 104907 (2012). Adding a very small amount of amino-alcohol molecule at the bonding interface drastically increased the bonding energy after low post bonding annealing temperature. In this study, additional developments using the same molecule type (DEAE: N-N-diethylaminoethanol) are presented.
Topics & Concepts
MoleculeAnnealing (glass)Materials scienceWaferSiliconOxideAlcoholWafer bondingAnodic bondingNanotechnologyChemical engineeringOrganic chemistryOptoelectronicsChemistryComposite materialMetallurgyEngineering3D IC and TSV technologiesNanofabrication and Lithography TechniquesAdvanced Surface Polishing Techniques