Intermediate Low-Melting-Temperature Solder Thermal Cycling Enhancement Using Bismuth and Indium Microalloying
Young-Woo Lee, Tae-Kyu Lee, Jae Pil Jung
Topics & Concepts
SolderingMaterials scienceIndiumBall grid arrayTemperature cyclingAtmospheric temperature rangePrinted circuit boardComposite materialElectronic packagingFlip chipSolidusMelting pointMetallurgyThermalElectrical engineeringThermodynamicsAdhesivePhysicsEngineeringLayer (electronics)AlloyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties