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The effect of interface stress on the grain boundary grooving in nanomaterials: Application to the thermal degradation of Cu/W nano-multilayers

A. V. Druzhinin, Claudia Cancellieri, Lars P. H. Jeurgens, Boris B. Straumal

2021Scripta Materialia24 citationsDOIOpen Access PDF

Topics & Concepts

Materials scienceInterphaseGrain boundaryNanomaterialsAnnealing (glass)Stress (linguistics)Stress relaxationQuenching (fluorescence)ThermalComposite materialNano-Relaxation (psychology)Thermal stabilityNanotechnologyThermodynamicsChemical engineeringMicrostructureCreepLinguisticsGeneticsQuantum mechanicsBiologyPsychologySocial psychologyPhilosophyEngineeringPhysicsFluorescenceMicrostructure and mechanical propertiesMetal and Thin Film MechanicsAluminum Alloys Composites Properties
The effect of interface stress on the grain boundary grooving in nanomaterials: Application to the thermal degradation of Cu/W nano-multilayers | Litcius