Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste
Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Aya Iwaki, Katsuaki Suganuma
Topics & Concepts
Materials scienceFlakeSinteringComposite materialPorosityShear strength (soil)MetallurgyEnvironmental scienceSoil scienceSoil waterElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties