Heat transfer enhancement for 3D chip thermal simulation and prediction
Chao Wang, Kambiz Vafai
Topics & Concepts
Support vector machineHotspot (geology)ThermalAlgorithmChipComputer scienceStandard deviationMathematicsArtificial intelligenceStatisticsGeologyPhysicsMeteorologyTelecommunicationsGeophysics3D IC and TSV technologiesHeat Transfer and OptimizationThermal properties of materials