The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach
Yong-Jae Kim, Byung‐Ho Park, Soong‐Keun Hyun, Hiroshi Nishikawa
Topics & Concepts
Materials scienceSinteringPorosityThermal conductivityComposite materialJoint (building)ThermalThermodynamicsEngineeringPhysicsArchitectural engineeringThermal properties of materialsElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties