Effect of temperature on the low cycle fatigue properties of BGA solder joints
Xin Wei, Ali Alahmer, Heneen Ali, Sufyan Tahat, Palash Pranav Vyas, Sa’d Hamasha
Topics & Concepts
Materials scienceSolderingBall grid arrayMetallurgyIntermetallicSolder pasteComposite materialAlloyElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisAluminum Alloys Composites Properties