Tetrafluorophenylene-Containing Vinylbenzyl Ether-Terminated Oligo(2,6-dimethyl-1,4-phenylene ether) with Better Thermal, Dielectric, and Flame-Retardant Properties for Application in High-Frequency Communication
Yi‐Chun Chen, Kamani Sudhir K. Reddy, Yu-An Lin, Mengwei Wang, Ching Hsuan Lin
Abstract
VTM-1 with dropping seriously) than the thermoset of OPE-2St. To verify the practicability of VT-OPE for copper-clad laminate, a laboratory process was also performed to prepare a copper-clad laminate, which shows a high peeling strength with copper foil (5.5 lb/in), high thermal reliability with a solder dipping test at 288 °C (>600 s), and the time for delamination of the laminate in thermal mechanical analysis (TMA) at 288 °C is over 60 min.
Topics & Concepts
Thermosetting polymerMaterials scienceComposite materialDielectricCopperFire retardantDissipation factorEtherCyanate esterPhenyleneAnalytical Chemistry (journal)PolymerChemistryOptoelectronicsOrganic chemistryMetallurgySynthesis and properties of polymersEpoxy Resin Curing ProcessesSilicone and Siloxane Chemistry