Effects of process parameters and chamber structure on plasma uniformity in a large-area capacitively coupled discharge
Jicheng Zhou, Jia Liao, Jing Huang, Chen Techao, Bowen Lv, Yichang Peng
Topics & Concepts
PlasmaCapacitively coupled plasmaMultiphysicsRADIUSElectrodeMaterials scienceEnhanced Data Rates for GSM EvolutionPlasma-enhanced chemical vapor depositionPlasma parametersAtomic physicsDeposition (geology)ChemistryInductively coupled plasmaAnalytical Chemistry (journal)MechanicsChemical vapor depositionOptoelectronicsPhysicsThermodynamicsChromatographySedimentTelecommunicationsBiologyQuantum mechanicsComputer securityComputer scienceFinite element methodPaleontologyPhysical chemistryPlasma Diagnostics and ApplicationsMetal and Thin Film MechanicsElectrostatic Discharge in Electronics