Litcius/Paper detail

Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing

Shang Gao, Honggang Li, Han Huang, Renke Kang

2022Applied Surface Science154 citationsDOI

Topics & Concepts

LappingChemical-mechanical planarizationPolishingGrindingSurface integrityMaterials scienceWaferSurface roughnessSiliconComposite materialSurface finishMachiningLayer (electronics)MetallurgyOptoelectronicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationDiamond and Carbon-based Materials Research
Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing | Litcius