Topological approach for optimization of liquid cooled plate with different inlet/outlet parameters
Tao Wang, Yizhong Wang, Hemin Hu
Abstract
In this paper, a numerical simulation method is used to optimize the topology of the liquid cooled plate structure in the heat dissipation module of IGBT chips. The paper takes the flow resistance minimization and heat transfer maximization as the dual objectives, and assigns weights to the objective function, and realizes the topology optimization design of the liquid cooled plate through mathematical methods. Investigates the effects of different values of the thermal weight factor w 1 and different inlet/outlet parameters on the performance of the liquid cooled plate. Analyze the topology optimization results in 2D and filter the outcomes using the Pareto Curve , and then the topology optimized liquid cooled plate (TO) is compared with the traditional straight channel liquid cooled plate (TSC) in 3D at different inlet velocities for comprehensive performance. The results indicate that the variation of inlet/outlet parameters has a better optimization effect on the average temperature T ave and pressure drop Δ P of the liquid-cooled plate after topology optimization, and the thermal resistance R th of the TO is reduced by 7 %–50 % and the average heat transfer coefficient h ave is increased by 18.6 % for different operating conditions compared with the traditional straight channel liquid-cooled plate. And the PEC value of TO is always greater than 1.