Laminated Cu-GO-Cu composite foils with improved mechanical and thermal properties by alternating DC electro-deposition and electrophoresis
Weizhen Wang, Fengjia Li, Xu Yan, Ke Zhan, Tian Wang, Zheng Yang, Zhuo Wang, Bin Zhao
Abstract
Cu-graphene oxide (GO)-Cu laminated composites foils with a “brick-mud” structure were designed and fabricated by an alternating methods of direct current deposition and electrophoresis. The effects of processing parameters and laminated structure on its micro-structure and mechanical/thermal properties were investigated, and the grain nucleation and growth behavior on GO during the electro-deposition was analyzed. The results revealed that compared with pure Cu foils, the maximum tensile strength increased from 237 MPa to 308 MPa. While, the thermal conductivity of Cu-GO-Cu laminated composites with optimized condition increased 11% to 439.60 W m−1 K−1. The existence of loose GO made it easier for copper ions to pass through and form more denser network structure, so that the performance of composite foils can be optimized. The enhanced mechanical and thermal properties are attributed to favorable interfacial bonding and well-designed laminated structure of Cu-GO composites.