A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickening
Zhao‐Yun Wang, Lei Jin, Jiaqiang Yang, Weiqing Li, De‐Yin Wu, Dongping Zhan, Fang‐Zu Yang, Shi‐Gang Sun, Shi‐Gang Sun
Topics & Concepts
ChemistryCopperCopper platingAdsorptionPlating (geology)PEG ratioChemical engineeringPolyethylene glycolThickeningInorganic chemistryLayer (electronics)Organic chemistryGeophysicsEconomicsFinancePolymer scienceGeologyEngineeringElectroplatingElectrodeposition and Electroless CoatingsCorrosion Behavior and InhibitionCopper Interconnects and Reliability