A developed crystal plasticity model for viscoplastic mechanical behavior of SAC305 solder under thermomechanical coupled cyclic loading
Mingwei Xie, Gang Chen
Topics & Concepts
Materials scienceViscoplasticityComposite materialSolderingTemperature cyclingPlasticityCyclic stressAtmospheric temperature rangeSofteningThermomechanical analysisConstitutive equationThermalThermal expansionStructural engineeringFinite element methodThermodynamicsPhysicsEngineeringElectronic Packaging and Soldering TechnologiesMicrostructure and mechanical propertiesHigh-Velocity Impact and Material Behavior