Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
Romina Sattari, Dong Hu, Xu Liu, Henk van Zeijl, Sten Vollebregt, Guoqi Zhang
Topics & Concepts
Materials scienceDie (integrated circuit)Transient (computer programming)ThermalComposite materialNano-ChipMetalMetallurgyEngineeringNanotechnologyElectrical engineeringOperating systemComputer scienceMeteorologyPhysicsSilicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering TechnologiesThermal properties of materials