Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test
Yue Gao, Jinting Jiu, Chuantong Chen, Katsuaki Suganuma, Rong Sun, Zhi‐Quan Liu
Topics & Concepts
Materials scienceMetallurgyThermalComposite materialThermodynamicsPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies