Litcius/Paper detail

Sol–gel polishing technology for extremely hard semiconductor substrates

Qiufa Luo, Hailang Wen, Jing Lu

2022The International Journal of Advanced Manufacturing Technology19 citationsDOI

Topics & Concepts

PolishingChemical-mechanical planarizationAbrasiveMaterials scienceSemiconductorDiamondSemiconductor device fabricationSubstrate (aquarium)SapphireMetallurgyOptoelectronicsWaferOpticsLaserPhysicsGeologyOceanographyAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchMetal and Thin Film Mechanics
Sol–gel polishing technology for extremely hard semiconductor substrates | Litcius