Design and performance evaluation of an anti-expansion 3D vapor chamber for multi-chip cooling in high heat flux applications
Shiwei Zhang, Boyang Chen, Wei Zhao, Shubin Yin, Wei Ji, Yong Tang
Topics & Concepts
Materials scienceChipHeat fluxNuclear engineeringHigh heatFlux (metallurgy)Mechanical engineeringThermodynamicsHeat transferComposite materialEngineeringElectrical engineeringMetallurgyPhysicsHeat Transfer and Boiling StudiesHeat Transfer and OptimizationRefrigeration and Air Conditioning Technologies