Pressureless sinter joining of bare Cu substrates under forming gas atmosphere by surface-oxidized submicron Cu particles
Daiki Yamagiwa, T. Matsuda, Hideki Furusawa, K. Sato, Hiroaki Tatsumi, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Topics & Concepts
Materials scienceSinteringOxideNanoparticleLayer (electronics)Atmosphere (unit)ThermogravimetryTransmission electron microscopyMetallurgyReducing atmosphereComposite materialChemical engineeringNanotechnologyThermodynamicsPhysicsEngineeringElectronic Packaging and Soldering TechnologiesNanomaterials and Printing TechnologiesAluminum Alloys Composites Properties