Coupled Process Modeling of Flow and Transport Phenomena in LCM Processing
Pavel Šimáček, Navid Niknafs Kermani, Suresh G. Advani
Topics & Concepts
Transfer moldingProcess (computing)SolverComputer scienceFlow (mathematics)MultiphysicsTransport phenomenaInterface (matter)Heat transferModular designMechanical engineeringProcess engineeringSimulationMaterials scienceMechanicsEngineeringParallel computingFinite element methodPhysicsMoldProgramming languageOperating systemBubbleStructural engineeringComposite materialMaximum bubble pressure methodInjection Molding Process and PropertiesEpoxy Resin Curing ProcessesAdvanced materials and composites