Interface failure behavior and mechanisms of 4H-SiC wafer with alloy backside layer caused by different dicing technologies
Meina Qu, Yi Zhang, Chuanzhen Huang
Topics & Concepts
Wafer dicingMaterials scienceAlloyWaferLayer (electronics)Interface (matter)OptoelectronicsMetallurgyComposite materialCapillary actionCapillary numberAdvanced Surface Polishing TechniquesSilicon Carbide Semiconductor TechnologiesIntegrated Circuits and Semiconductor Failure Analysis