Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations
Xiaoyang Bi, Xiaowu Hu, Qinglin Li
Topics & Concepts
Materials scienceSolderingIntermetallicBall grid arrayShear strength (soil)Composite materialMetallurgyCoatingShear (geology)Direct shear testAlloySoil scienceSoil waterEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis