Mixed mode fracture toughness of epoxy molding compound/printed circuit board interface of semiconductor packages with respect to temperature and moisture
Hui-Jin Um, Se-Min Lee, Daewoong Lee, Sangyul Ha, Hak‐Sung Kim
Topics & Concepts
Materials scienceFracture toughnessComposite materialEpoxyDelamination (geology)ToughnessFinite element methodFracture (geology)Fracture mechanicsAdhesiveStructural engineeringLayer (electronics)EngineeringSubductionPaleontologyBiologyTectonicsMechanical Behavior of CompositesElectronic Packaging and Soldering TechnologiesMaterial Properties and Processing