Electromigration-induced microstructure evolution and failure mechanism of sintered nano-Ag joint
Zhi Hao Jin, Fupeng Huo, Jianhao Wang, Xunda Liu, Y.C. Chan, Hiroshi Nishikawa
Topics & Concepts
Materials scienceElectromigrationDelamination (geology)MicrostructureCathodeSolderingJoint (building)SinteringComposite materialFlip chipInterconnectionNano-IntermetallicMetallurgyLayer (electronics)AlloyComputer scienceTectonicsPhysical chemistryArchitectural engineeringPaleontologyEngineeringComputer networkAdhesiveBiologyChemistrySubductionElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability3D IC and TSV technologies