Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish

I. A. Weng, H. T. Hung, Weichen Huang, C. R. Kao, Y. H. Chen

2020Journal of Electronic Materials12 citationsDOI

Topics & Concepts

Materials scienceCopperNucleationInterconnectionElectroless depositionMetallurgyImmersion (mathematics)Electroless platingSurface finishDissociation (chemistry)Composite materialNanotechnologyLayer (electronics)ElectroplatingChemistryComputer networkOrganic chemistryComputer scienceMathematicsPhysical chemistryPure mathematics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesNanofabrication and Lithography Techniques