Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Keuntae Baek, Minhyeok Kim, Hak‐Sung Kim, Jinho Ahn, Hongyun So
Abstract
Abstract Photonic integrated chip packaging is a promising technology for integrating optical components into devices, enabling high‐speed data transmission, wide bandwidth, low latency, and high energy efficiency. This technology is expected to overcome the limitations of traditional electronic component technologies. Particularly, recent advancements in high‐performance semiconductors, quantum computing, and data centers demand high‐speed data processing and transmission. In response to these demands, device packaging developments have focused on achieving compactness, high efficiency, and high performance. Photonic integrated chip packaging emerges as a promising approach to meet these demands. This review discusses the latest developments in photonic integrated chip packaging at the component, chip, and system levels. It also highlights the current issues and challenges of these technologies and provides future perspectives.