Measurement of mixed-mode fracture characteristics of an epoxy-based adhesive using a hybrid digital image correlation (DIC) and finite elements (FE) approach
A. Owens, Hareesh V. Tippur
Topics & Concepts
Materials scienceDigital image correlationFinite element methodStress intensity factorFracture (geology)EpoxyMode (computer interface)Composite materialDisplacement (psychology)Stress (linguistics)Intensity (physics)AdhesiveFracture mechanicsStructural engineeringComputer scienceOpticsPhysicsEngineeringLayer (electronics)PhilosophyOperating systemPsychologyLinguisticsPsychotherapistOptical measurement and interference techniquesMechanical Behavior of CompositesStructural Health Monitoring Techniques