Microstructural characterization of alloyed palladium coated copper wire under high temperature
Motoki Eto, Noritoshi Araki, Takashi Yamada, Masaaki Sugiyama, Shinji Fujimoto
Topics & Concepts
PalladiumWire bondingMaterials scienceCopperMicrostructureMetallurgyDegradation (telecommunications)Reliability (semiconductor)Copper wireCorrosionCatalysisChemistryElectronic engineeringElectrical engineeringEngineeringQuantum mechanicsChipBiochemistryPower (physics)PhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesCopper Interconnects and Reliability