Modeling and Simulation of Hafnium Oxide RRAM Based on Oxygen Vacancy Conduction
Jinfu Lin, Hongxia Liu, Shulong Wang, Siyu Zhang
Abstract
The resistive memory has become one of the most promising new memory types because of its excellent performance, and HfO2 resistive material has attracted extensive attention. The conduction mechanism based on oxygen vacancy is widely recognized in the research of new nonvolatile memory. An RRAM electrothermal coupling model based on the oxygen vacancy conduction mechanism was constructed using COMSOL. The resistance process of the device is simulated by solving the coefficient partial differential equation, and the distribution of oxygen vacancy concentration, temperature, electric field, electric potential and other parameters in the dielectric layer at different voltages are obtained. The effects of temperature, dielectric layer thickness, top electrode thermal conductivity and conductive wire size on the resistance characteristics of the device are studied. It has guiding significance to further study the RRAM mechanism.