Litcius/Paper detail

Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints

Yinbo Chen, Zhichao Meng, Li‐Yin Gao, Zhi‐Quan Liu

2021Journal of Materials Science Materials in Electronics48 citationsDOI

Topics & Concepts

Materials scienceSolderingBrittlenessKirkendall effectBrittle fractureShear strength (soil)MetallurgyComposite materialCleavage (geology)Shear (geology)MicrostructureFracture (geology)Environmental scienceSoil scienceSoil waterElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis
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