Numerical analysis of thermal and mechanical characteristics with property maps in complex semiconductor package designs
Jeong-Hyeon Park, Hwanjoo Park, Tae-Hwan Kim, Jaechoon Kim, Eun‐Ho Lee
Topics & Concepts
Finite element methodSemiconductorProperty (philosophy)ThermalMechanical engineeringComputer scienceMaterials scienceElectronic engineeringStructural engineeringEngineeringOptoelectronicsPhysicsEpistemologyPhilosophyMeteorologyElectronic Packaging and Soldering TechnologiesAdvanced Multi-Objective Optimization AlgorithmsTopology Optimization in Engineering