Experimental and computational studies on TAD as an additive of copper chemical mechanical polishing
Jinxiang Huo, Baohong Gao, Bin He, wenhaoyu li, Bin Liang, Mingyu Liu, Xuhua Chen
Topics & Concepts
Materials scienceCopperPolishingMetallurgyChemical-mechanical planarizationComposite materialAdvanced Surface Polishing TechniquesAdvanced materials and compositesIntegrated Circuits and Semiconductor Failure Analysis