Cu–Cu bonding using bimodal submicron–nano Cu paste and its application in die attachment for power device
Yu-bo Xiao, Yue Gao, Zhi‐Quan Liu, Rong Sun, Yang Liu
Topics & Concepts
Materials sciencePorosityNano-Shear strength (soil)Electrical resistivity and conductivityComposite materialDie (integrated circuit)CopperSinteringBonding strengthMetallurgyNanotechnologyEnvironmental scienceEngineeringSoil scienceSoil waterElectrical engineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability