Integrated manifold microchannels and near-junction cooling for enhanced thermal management in 3D heterogeneous packaging technology
Wei He, Ershuai Yin, Fan Zhou, Yang Zhao, Dinghua Hu, Jiaqi Li, Qiang Li
Topics & Concepts
Thermal management of electronic devices and systemsManifold (fluid mechanics)ThermalMaterials scienceMechanicsMechanical engineeringEngineeringThermodynamicsPhysicsHeat Transfer and Optimization3D IC and TSV technologiesElectronic Packaging and Soldering Technologies