Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
Zs. Tôkei, V. Vega, Gayle Murdoch, Martin G. O’Toole, Kristof Croes, Rogier Baert, M. van der Veen, Christoph Adelmann, Jean-Philippe Soulié, Juergen Boemmels, Christopher Wilson, S. H. Park, Kiroubanand Sankaran, Geoffrey Pourtois, J. Sweerts, Sara Paolillo, Stefan Decoster, Ming Mao, F. Lazzarino, Janko Versluijs, Víctor Blanco, Monique Ercken, E. Kesters, Quoc Toan Le, Frank Holsteyns, N. Heylen, Lieve Teugels, K. Devriendt, Herbert Struyf, P. Morin, N. Jourdan, Sven Van Elshocht, Ivan Ciofi, Anshul Gupta, Houman Zahedmanesh, Kris Vanstreels, M. H. Na
Abstract
Interconnect options will be introduced and reviewed targeting tight pitch metal layers at the local levels. Examples include hybrid metallization, semi-damascene interconnects as well as potential new conductor materials.